Kvalitets audit af APC
Yuan Guangming GM
Kevin Liao Manager
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Rigrid PCB, FPCB, Flex-rigrit PCB,
MCPCB
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Service ydelser:
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Firma profil:
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- Rigid PCB
- FPCB
- Flex-rigid PCB
- MCPCB
- PCBA
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- Ca 1200 ansatte
- Areal 12000 m ²
- Honk Kong
- Shenzhen
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Kababilitet :
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Kvalitetsstandarder:
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- Antal lag 1-16
- Min. Line 0,075mm single
- Min. Line 0,1mm double S.
- Min. Line Afstand 0,1mm
- Min hul 0,3 mm
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- UL ISO 9000:2000
- QS 9000
- Norm: UL, CSA
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Min Ordre (MOQ): |
Prisniveau: |
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Min 1-20 Stk på quick service |
Under 30-40% af dansk pris. |
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The FPC facility was established in year of
2004,specialising the design and manufacturing FPC.
APC´s partner is a company based in Hong Kong with facilities in mainland
China, formed in 1995.
With year's development, we have been into an enterprise
who supplies PCB, FPC.
Our specialty is flexibility, meeting customer demands is our tenet
and continuously improving our service is invariable pursuit. Base
on the doctrine, we have offered clients low volume manufacturing
and 24 hours prototypes fast turnaround delivery.
We still remain our own punching tool/stamping tool house to meet
the demands of large volume single-sided boards. It is also an
active transaction in our company.
There're more than 1200 workers in houses, with 2 shifts every day.
Our PCB's are widely applied to computer and computer peripheral,
home appliance, wireless devices, communication career, medical,
navigation and martial field etc. Monthly capacity is up to 0.4
million square feet for rigid PCB, PTH, and 0.21 million square feet
for FPC. Customers are distributed mainly in South-east Asia, Europe
and Australia etc.
To comply with EU RoHS compliant, we have introduced immersion gold,
immersion tin etc surface finish and halogen free material since
2004. These boards have been put into mass production in 2005. With
regard to flexible PCB, We use Taiwan PI and Kapton on request, 25um
and 50 um are available.
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Produkt eksempler Rigid PCB
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Produkt eksempler FPCB og MCPCB
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Flex-rigid
PCB |
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Flex-rigid PCB |
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Flex-rigid PCB |
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Flex-rigid PCB |
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Flex-rigid PCB |
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Flex-rigid PCB |
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Flex-rigid PCB |
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Rigid PCB Production
Capacity
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Item
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Mass Production Capacity
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Layer Counts
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1~16 layer
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Material
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FR-4, High Tg FR-4，CEM-1, CEM-3, FR-1,
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FR-2，XPC，Aluminum Base, Teflon PTFE
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Material Mixed Laminate
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4 layers —8 layers
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Maximum Size
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610mm X 720mm
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Board Outline Tolerance
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±0.13mm
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Board Thickness
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0.40mm—3.20mm
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Thickness Tolerance
( t≥0.8mm)
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±8%
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Thickness Tolerance
( t＜0.8mm)
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±10%
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Insulation Layer Thickness
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0.10mm—6.00mm
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Minimum Line
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0.10mm
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Minimum Space
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0.10mm
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Out Layer Copper Thickness
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17um—140um
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Inner Layer Copper Thickness
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17um—105um
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Drilling Hole (Mechanical)
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0.30mm—6.35mm
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Finish Hole (Mechanical)
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0.20mm—6.30mm
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Diameter Tolerance (Mechanical)
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0.05mm
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Registration (Mechanical)
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0.075mm
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Laser Hole
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0.10mm (out source)
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Aspect Ratio
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10:1
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Solder Mask Type
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LPI, UV Cure
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SMT Mini. Solder Mask Width
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0.10mm
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Mini. Solder Mask Clearance
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0.05mm
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Plug Hole Diameter
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0.25mm—0.60mm
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Impedance Control Tolerance
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±10%
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Surface Finish
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HASL, HASL Lead free, Immersion Gold, OSP,
Peelable mask, Gold finger.
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Electrolytic Gold, Immersion tin， Immersion
Silver, Carbon ink,
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Capability of
Flexible circuits
| Material
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Polyimide (PI) Polyester (PET)
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Remark
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Layer count
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1 up to 4 layer 1 up to 2 layer
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Min track
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Single sided |
0.075mm (3mil)
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| Min space |
Double sided
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0.100mm (4mil)
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| Min hole |
Drill
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0.3mm
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| Punch |
0.5mm
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| Dimension
Tolerance
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Track width (W)
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+/- 0.03mm
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W ≤ 0.5mm
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| Hole (H) |
+/- 0.05mm
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H ≤ 1.5mm
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| Pile distance (P) |
+/- 0.05mm
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P ≤ 25mm
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| Profile size (L) |
+/- 0.05mm
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L ≤50mm
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| Outline (C) |
+/- 0.075mm
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C ≤ 5.0mm
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Surface finish
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Hard Ni/Au (Au 0.05~1.25μm), Pb/Tin
(2~20μm), HASL (only for PI) |
| Copper weight |
9 μm, 12μm, 18μm, 35μm, 70μm |
Insolated resistance
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1000m ohm
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IPC-TM-650 2, 6, 3, 2 |
Dielectric intensity
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5 kv
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IPC-TM-650 2,5,6,1
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Surface resistance
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5 x E12
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2 x E15
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IPC-TM-650 2,5,17 |
| Touch resistance |
1 x E15
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1 x E15
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IPC-TM-650 2,5,17 |
Dielectric constant
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4.0 |
3.0 |
MIL-P-55617 |
| Coefficient of divergence |
0.04 |
0.03 |
MIL-P-55617 |
Peel-off intensity
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1.0kg f/cm
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1.2kg f/cm
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IPC-TM-650 2,4,9 |
| Solder intensity |
300 ℃/10 sec
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210 ℃/10 sec
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IPC-TM-650 2,4,9 |
Flammability
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94VTM-0 |
94VTM-0
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UL 94 |
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MCPCB Production
Capacity
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Capability of MPCB
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Material
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Aluminum
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Remark&Test |
Layer count
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1-2layer
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Min track& width
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0.1 mm (4mil)
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百倍镜 |
| 最小孔径 |
钻孔
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φ 0.40 mm
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百倍镜 |
| 冲孔 |
φ 2.0 mm |
百倍镜 |
| 最大钻杯 |
φ 8.00 mm |
MIL-P-55617 |
| 尺寸公差 |
导线宽度
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± 20%
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IPC-TM-650 2,4,9 |
| 孔径 |
± 0.05 mm |
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| 累积间距 |
± 0.10 mm |
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| 外形公差 |
± 0.1 mm |
L ≤50 mm |
| 边间距 |
± 0.05 mm
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C ≤5.0 mm |
| 表面处理 |
化学镀金 |
Au(0.03-0.10 um);Ni(1-6 um) |
X-RAY 机 |
| 喷纯锡 |
Sn(6-18 um) |
| 防氧化（OSP） |
0.2-0.8um |
| 焊接温度 |
满足无铅焊 |
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Main equipment for Circuits
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Main equipment for Circuits
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Equipment
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Brand
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Quantity
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| Drilling Machine-Six Spindles |
KLNGELNBERG |
10
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Drilling Machine-Eight Spindles
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PLURITEC |
4
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Artwork Exposing Machine
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WANG CHANG
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2
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Artwork Developing Machine
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FOLEX |
1
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Dry Film Laminating Machine
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JIANN HAUTR
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2
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Dry Film Exposing Machine
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JIANN HAUTR
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4
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| Dry Film Developing M/C |
SONG TES
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1
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Dry Film Developing
Machine
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SONG TES |
1
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Blade Shaping Machine
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GHING HUEI
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1
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| Liquid Mask Exposing Machine |
CSUN |
3
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Scrubbing Machine
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SONG TES
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2
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Liquid Mask Developing Machine
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INTECH |
1
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Liquid Mask Printing Machine
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CHING HUEI
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5
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Print Exposing Machine
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KUWA CHAN
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1
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High Voltage Testing Machine
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SINK or FOREVER
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6
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| Oven |
CSUN |
7
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Laminates Cutting Machine
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SHETA |
1
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Board Cleaning Machine
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KUN-PAO-INDUSTRIAL
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1
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Diazo Film Protector
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LEOCO
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1
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Film Protector
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LEOCO
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1
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Hot Air Leveling Machine
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KUN-PAO-INDUSTRIAL
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5
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CNC Machine
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LIH SONG
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6
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Universal Tester
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CIRCUITLINE |
13
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V-CUT Machine
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SHODA TECHIRON
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3
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Gold Finger Beveling Machine
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JYH HAUR
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2
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Flying Probe Testing Machine
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PORBAR
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2
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Automatic Testing Machine
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SINK |
1
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Impedance Measuring Machine
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HEWLETT PACKARD
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1
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Legend Printing Machine
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Colead
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4
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