P1
P2

P3
 

   Rigrid PCB, FPCB, Flex-rigrit PCB, MCPCB

  Service ydelser: Firma profil:
 
  • Rigid PCB
  • FPCB
  • Flex-rigid PCB
  • MCPCB
  • Alu. PCB
  • Ca 500 ansatte
  • Areal 5000 m ²
  • Honk Kong
  • Shenzhen
  Kababilitet : Kvalitetsstandarder:
 
  • Antal lag 1-18
  • Min. Line 0,075mm single
  • Min. Line 0,1mm double S.
  • Min. Line Afstand 0,1mm
  • Min hul 0,15 mm
  • UL ISO 9000:2000
  • QS 9000
  • Norm: UL, CSA
  Min Ordre (MOQ): Prisniveau:
  Min 1-3 Stk på quick service Under 30-40% af dansk pris.
 P4

P5
  

APC´s partner produce High-density 2-18 layer circuit board with blind and buried vias , High TG thick copper boards, Hi-frequency boards, HDI board, FPC board , Rigid and Flexible boards, ALU-base boards etc .COREPCB develops at high speed, , and its annual capacity has reached 200,000 ㎡. It has become the important partner and friends of over 2000 companies both at home and abroad

    

Leveringstid

Item

Quick Turn

General Lead Time

Our Service

Double Sided

24h

72h

Quote in an hour

4-layer

48h

144h

Technical support at any time

6-layer

60h

168h

Marketing service day and night

8-layer

72h

192h

Ship goods all day long

10-layer

96h

240h

Production boards around the clock

>10-layer

96h

240h

 

Parameters

    

Item

Technical Parameters

Specification

     

Min.Line Width(mil)

3/4

Partial 3mil lines is allowed

Min.Space(mil)

3/4

Partial 4mil lines is allowed

Min.Annular Ring Width(mil)

VIAS:3mil

Remained ring width means the distance between thehole edge to the ring outskirt

Component Holes:7mils

Min.Hole Size

Board Thickness<2.0mm

0.15mm

___

Board Thickness>=2.0mm

Aspect Ratio<=12

___

Max.Board Thickness

Single and Double Sided

8.0mm

 

Multilayer

8.0mm

Min.Board Thickness

Single and Double Sided

0.2mm

Multilayer

4 layers:0.4mm; 6 layers:0.6mm

 

8 layers:1.0mm;10 layers:1.2mm

Max.Board Size

Single and Double Sided

650*1100mm

Multilayer

650*1100mm

Distance between Line to Board edge

Outline:0.20mm

V-CUT:0.4mm

Max.Layers

18 layers

Solder mask

Mask Window(mil)

2/4

1.Single side;2.2mil is allowed for mask bridge or avoiding exposed lines

Mask Bridge(mil)

5

Between IC pins

Color

White,Black, Blue,Green,Yellow,Red,ect.

___

Legend

Min.Line Width(mil)

4

___

Color

White,Black,Yellow,ect.

___

Surface Plating

HAL(with Pb free),Plated Ni/Au,Ag,Imm Ni/Au,Imm Sn,Ag,OSP etc.

___

Plating Thickness (microinch)

Technique

Plating Type

Min.Thickness

Max.Thickness

 

Plated Ni/Au

Ni

100

150

Au

1

3

Immersion Ni/Au

Ni

100

150

Au

1

4

Gold Finger

Ni

120

150

Au

10

25

Copper Plating Hole (micron)

Copper Thickness

20

25

 

Base Copper Thickness

Inner Layers and Outer Layers(OZ)

0.5

13

Finished Copper Thickness

Outer Layers

1

13

Inner Layers

0.5

13

Insulation Layer(mm)

0.06

----

Line Width/Space(mil)

Max.Copper Thickness

___

4/4; 4/5

0.5 OZ

___

Line width shouldn't be less than the required value under ensure of space.

4/6; 5/5; 6/5

1 OZ

___

5/6; 6/6

2 OZ

___

6/8; 7/8; 8/8

3 OZ

___

8/10; 9/10; 10/10

5 OZ

___

Board Materials

FR-4; Aluminum Base; High Frequency; PFTE; FPC; Thick Copper; BT Base;Pi Base; Tg130℃/ Tg170℃,Rogers4003, Berquist, Thermagon, (Taconic)

___

Board Outline Tolerance:

L<=100mm: 0.1mm; 100mm<L<=200mm: 0.2mm; 200mm<L<=300mm: 0.3mm: 300mm<L<=.....: 0.3mm

Finished Product Thickness Tolerance:

0.2mm<T<0.5mm: +/-0.05mm; 0.5mm<T<0.8mm: +/-10%; >=0.8mm: +/-8%

Impedance Control:

+/-10%

 

Capacity

       

Layers

2-18 layers

Max manufacturing size

700 mm*1100 mm

Board thickness

Double sided

0.2mm-6.0mm

4 layers

0.4mm-8.0mm

6 layers

0.8mm-8.0mm

8 layers

1.0mm-8.0mm

10 layers

1.2mm-8.0mm

12 layers

1.5mm-8.0mm

Copper foil thickness

0.5oz--13oz

Min Line Width/Space

3mil/3mil

Min finished holes size

0.15mm

Aspect ratio

12:1

Impedance Control

+/-10%

Surface treatment

HAL(with Pb free),Plated Ni/Au,Ag,Imm Ni/Au,Imm Sn,Ag,OSP etc.

Materials

FR4(S1130/S1141/S1170),Tg130℃/Tg170℃,Rogers,Berquist,thermagon,(taconic)

Double sided Capacity

60000M2/Year

Multilayer Capacity

100000M2/Year

Equipments

                  P6
P7
P8
P9
P10

Kvalitets Certificering

              

P12

B1B2B3B4B6
B7 B8 B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 B24
F10 F11 F12
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